 |
 |
 |
Thermal Management Systems
HATMS™
ITMS™
PCS™
RITMS™
TCS™
Thermal Head
Thermal Head Description
101NJXXS
101PJXXS
101RJXXS
DUT - Device Under Test
HATMS - Hybrid Air Thermal Management System
ITMS - Integrated Thermal Management System
MRPSS - Modular Rack Power Supply System
PCS - Passive Cooling System
TCS -Thermal Control System
RITMS - Rack integrated Thermal Management System
TH - Thermal Head
Thermal Head™ OverviewThe performance of the USTC Thermal Head™ is enhanced by interlocking longitudinal axis, opposing jet technology. The advantages of this new technology are:
- The lowest thermal resistance in the industry with performance to 4°C per 100W
- The highest Critical Heat Flux approaching1200W/cm2
- The structure to suppress processor hot spots for ultra-efficiency
The Thermal Head (TH) together with a proprietary USTC controller are used to actively manage the DUT (Device Under Test, predominantly processors) thermals and is specifically designed to meet cold mode, hot mode or thermal cycling test requirements.
Every TH model has unique PID (Proportional-Integral-Derivative) parameters programmed by the controller for optimal performance.
The standard TH consists of a heat sink, a TEM (Thermoelectric Module) and a heat spreader.
A TH is in two types: a liquid cooled and an air cooled. The liquid cooled TH can be applied jointly with a USTC controller having a liquid coolant circuit or a chiller; the air cooled TH is self-sufficient, contains a built-in fan and can be applied as a stand-alone thermal control system.
Made in USA