Thermal Management Systems

  HATMS™
  ITMS™
  PCS™
  RITMS™
  TCS™

  Thermal Head

 Thermal Head Description 
  101NJXXS
  101PJXXS
  101RJXXS

 

DUT - Device Under Test

HATMS - Hybrid Air Thermal Management System

ITMS - Integrated Thermal Management System

MRPSS - Modular Rack Power Supply System

PCS - Passive Cooling System

TCS -Thermal Control System

RITMS - Rack integrated Thermal Management System

TH - Thermal Head

Hybrid Air Thermal Management System Overview

The Hybrid Air Thermal Management (HATMS) is designed to dissipate power on microprocessors using air for cooling. The USTC™ Thermal Head (TH) contains a radiator and a fan for performing this function. The HATMS™ proprietary controller was designed specifically for this system. The small controller enclosure houses the electronics and hardware for communications and power.

Made in USA

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Specifications

Control Hub Dimensions(")	4.5(L) x 2(W) x 3.58(H)
(mm)	114(L) x 51(W) x 91(H)
Power Supply Dimensions(")	6.69(L) x 4.72(W) x 3.66(H)
(mm)	170(L) x 120(W) x 93(H)
Max Current	10A
Max Voltage	12V
TE Switching Frequency	20khz
Temperature Resolution	0.1°C
Temperature Accuracy	+/- 2°C
Temperature Update Rate	10°C to 100°C
Fuse Rating	10A
RS232 Protocol	MODBUS with register numbers similar to Watlow 96 series
Recommended Ambient Air Temp	20°