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Thermal Management Systems
HATMS™
ITMS™
PCS™
RITMS™
TCS™
Thermal Head
Thermal Head Description
101NJXXS
101PJXXS
101RJXXS
USTC Product Spotlight - Rack Integrated Thermal Management System
DUT - Device Under Test
HATMS - Hybrid Air Thermal Management System
ITMS - Integrated Thermal Management System
MRPSS - Modular Rack Power Supply System
PCS - Passive Cooling System
TCS -Thermal Control System
RITMS - Rack integrated Thermal Management System
TH - Thermal Head
USTC specializes in Thermal Management on a Processor and delivers solutions that integrate direct Thermal Head™ contact on a CPU with the variety of controllers, air and liquid cooling systems used for tailoring a good range of processor control options.
In 1996, USTC made the first Thermal Solution for managing the heat on an Intel® Slot1 CPU. As the processor roadmap and electronics industry has expanded into a myriad of size, power and performance options, so have USTC methods for managing thermals.
We always provide hands-on support and networking between our team and our customers so that a solution perfectly fits the requirements.
Hardware schematics are THERMAL HEAD™ + CONTROLLER + AIR/FLUID COOLING SYSTEM.
USTC solution features
- Scalable heat sinks for standard or custom geometries
- Smaller size Thermal Head™ with increased performance
- Lowest fluid pressure in the industry
- Consistent thermal performance, 25,000 thermo cycles standard
- Hardware with ergonomic size and weight for desk-top and bench-top use
- Low acoustic noise from 14 to 48db.
Thermal Head™ options
Temperature range options
- Standard Performance -10°C to +110°C
- High Performance -35°C to +120°C
- Optimal Performance -45°C to +135°C
- Extreme Performance -65°C to +155°C
Controller options
Whatever your requirements, the USTC team is your one-stop, full service, choice for thermal management solutions.