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Thermal Management Systems
HATMS™
ITMS™
PCS™
RITMS™
TCS™
Thermal Head
Thermal Head Description
101NJXXS
101PJXXS
101RJXXS
DUT - Device Under Test
HATMS - Hybrid Air Thermal Management System
ITMS - Integrated Thermal Management System
MRPSS - Modular Rack Power Supply System
PCS - Passive Cooling System
TCS -Thermal Control System
RITMS - Rack integrated Thermal Management System
TH - Thermal Head
Integrated Thermal Management System OverviewThe Integrated Thermal Management System (ITMS) is a very convenient and portable Thermal Tool™ which integrates the USTC TCS™ control options with ambient liquid, glycol-fluid modules in one enclosure.
This model is the most up-to-date version of the original USTC thermal tool released in 1996. The 2009 model is incorporates all of the best features and specifications gathered from 13 years of application in the field around the world. From the very first pre-Pentium products to the most current computer processor packages, this style of product has met and exceeded the requirements of validation testing on processors within a wide range of power wattage, power density and package sizes.
The ITMS™ is a cost-effective solution because of the small footprint system scaled to satisfy a wide range of processor and chip power levels, varied temperature control requirements and all sizes of the USTC Thermal Head (TH) options. There are very few thermal management solutions that have met the challenges of application over 14 years straight.
The most practical feature of the ITMS™ is that a connected liquid TH will execute temperature control tasks utilizing the internal fluid modules without a remote exchanger, chiller or house water system. Internal fluid modules keep the cost of use down, and the overall design is so ergonomic that it also provides a validation tool ideal for desktop, bench top and rack use.
Every TH that connects to the ITMS™ has a Tcase thermocouple that measures the surface of a device under test (DUT). The controller, set to a desired test or monitoring temperature, drives the active TH to accurately and efficiently control temperature at the surface of a processor or chip. A temperature setting can be run manually if selected at the controller level; or, a controller may be interactive with a host computer and appropriate software, and by this means will control the TH. Different options of communication cable are available. Each TH channel is individually controlled according to the test mode employed, for instance, one TH may be in the heat mode while the other is in the cold mode.
For best performance and tightest tolerance to a set temperature requirement, each TH may be fastened to a specific test board, using USTC hardware. Performance is most reliable when the TH is correctly seated to a processor with quality thermal interface grease.
Made in USA
Specifications
Dimensions (”)
26.4” (L) x 17.3 (W) x 7.5” (H) Dimensions (mm)
317.5 (L) x 450.85 (W) x 273.05 (H) Weight
50 lbs. (22.7 kg) Power In
110 to 125VAC @ 50 to 60 Hz, 15 Amps, 1 Ph or 207 to 253VAC @ 50 to 60 Hz, 10 Amps, 1 Ph Thermal Head Configuration
2 channel Controller
Watlow Front Panel Indicators
Low fluid level LED Max Cooling Performance
2 x 1200W @ 30ºC ΔT (54ºF ΔT) Fluid
Propylene Glycol base Power Cord
10’ (3m) Operational Ambient Temperature
41°F to 95°F (5°C to 35°C)